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Acrosemi Corporation
Semiconductor, Microelectronic, Technology Equipments, Clean Room Products...
 
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Automatic Wire Bonder Agents

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Title: Automatic Wire Bonder Agents 
Unit price: Negotiable
MOQ: Negotiable
Quantity: Negotiable
Delivery date: Since the payment date Days delivery

Contact: Phil Nguyen (Mr.)    
Telephone:

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Model 353637E is a gantry with overhead ways and a moving bond head that brings the bonding function to the work and leaves the material handling process flow under customer control. The program runs under Windows XP Professional and is executed by a Pentium 4 processor housed in an Industrial CPU enclosure. Pattern Recognition is accomplished by Matrox components. The User Interface is displayed on a large LCD color display, and consists of many screen forms for user interaction. It allows to locate and bond automatically fine wire connections arrayed over a large, stationary work piece. There is no limit to the size of the work as this machine is entirely above the bond plane. The area traversed for bonding is five and three-eighths by nine and one-half inches; and successive areas could be presented. The wedge-wedge bonding method accepts aluminum wire, or gold wire with work piece heat. The primary wire feed method through angled clamps can be converted by exchange of clamp assembl
Automatic Wire Bonder Agents
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