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Acrosemi Corporation
Semiconductor, Microelectronic, Technology Equipments, Clean Room Products...
 
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Model 7374e (Beam Lead Die Bonders)
This machine adapted forultrasonic bonding, with heat, of the tab leads of beam lead diodes.The right head is used for p
Model 7367e (Eutectic Tweezer Die Bonder)
This machine with heads formechanized tweezers pick up and placement of die, and for vacuum pickup and placement of pref
Screen Printer Solar Cell Printer
AMI screen printers have you covered! Our precision screen printers take care of your present advanced packaging require
Automatic Wire Bonder Agents
Model 353637E is a gantry with overhead ways and a moving bond head that brings the bonding function to the work and lea
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